4
FN8233.9
November 30, 2010
Absolute Maximum Ratings
Thermal Information
Voltage on VDD, VBAT, SCL, SDA, RESET and IRQ/FOUT Pins
(respect to ground) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.0V
Voltage on X1 and X2 Pins
(respect to ground) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 2.5V
Latchup (Note 4) . . . . . . . . . . . . . . . . . . . Class II, Level B @ +85°C
ESD Rating
Human Body Model (MIL-STD-883, Method 3014) . . . . . . .>±2kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>175V
Thermal Resistance (Typical)
θ
JA (°C/W)
θ
JC (°C/W)
14 Ld SOIC Package (Notes 5, 6) . . . .
90
40
14 Ld TSSOP Package (Note 5, 6) . . .
110
35
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
4. Jedec Class II pulse conditions and failure criterion used. Level B exceptions are: Using a max positive pulse of 8.35V on all pins except X1 and
X2, Using a max positive pulse of 2.75V on X1 and X2, and using a max negative pulse of -1V for all pins.
5.
θ
JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
6. For
θ
JC, the “case temp” location is taken at the package top center.
DC Operating Characteristics
Unless otherwise noted, VDD = +2.7V to +5.5V, TA = -40°C to +85°C, Typical values are at TA = +25°C
and VDD = 3.3V. Boldface limits apply over the operating temperature range, -40°C to +85°C.
SYMBOL
PARAMETER
CONDITIONS
MIN
(Note 16)
TYP
MAX
(Note 16)
UNIT
NOTES
VDD
Main Power Supply
2.7
5.5
V
VBAT
Backup Power Supply
1.8
5.5
V
Electrical Specifications
Boldface limits apply over the operating temperature range, -40°C to +85°C.
SYMBOL
PARAMETER
CONDITIONS
MIN
(Note 16)
TYP
MAX
(Note 16)
UNIT
NOTES
IDD1
Supply Current with I2C Active
VDD = 2.7V
500
A
VDD = 5.5V
800
A
IDD2
Supply Current for Non-Volatile
Programming
VDD = 2.7V
2.5
mA
VDD = 5.5V
3.5
mA
IDD3
Supply Current for Main
Timekeeping (Low Power Mode)
VDD = VSDA = VSCL = 2.7V
10
A
VDD = VSDA = VSCL = 5.5V
20
A
IBAT
Battery Supply Current
VBAT = 1.8V,
VDD = VSDA = VSCL = VRESET = 0V
800
1000
nA
VBAT = 3.0V,
VDD = VSDA = VSCL = VRESET = 0V
850
1200
nA
IBATLKG
Battery Input Leakage
VDD = 5.5V, VBAT = 1.8V
100
nA
VTRIP
VBAT Mode Threshold
1.8
2.2
2.6
VTRIPHYS VTRIP Hysteresis
30
mV
VBATHYS
VBAT Hysteresis
50
mV
VDD SR-
VDD Negative Slew Rate
10
V/ms
IRQ/FOUT OUTPUT
VOL
Output Low Voltage
VDD = 5.5V
IOL = 3mA
0.3*VDD
V
VDD = 2.7V
IOL = 1mA
0.3*VDD
V
VOH
Output High Voltage
VDD = 5.5V
IOL = -1.0mA
VDD x 0.7
V
VDD = 2.7V
IOL = -0.4mA
VDD x 0.7
V
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